Residual Stress Measurement

 

Residual stress measurement inside metal components.

 

  X-ray diffraction is used to measure the residual stress inside mechanical components and other building objects.  MIRRORCLE uses high-energy white X-ray, which enable deep and non-destructive measurements. Furthermore, the energy dispersive method allows measuring of complex shapes.

 

 

 

Residual stress distribution measurement instrument apparatus：

 

 

 

 

X-ray source	MIRRORCLE-CV1
X-ray energy	10〜100keV
Optical system	Parallel optical system
Detector	Germanium semiconductor detector
Sample shape	Arbitrary
X-ray diameter	Less than 500μm（※）
Measurement region	Less than 1cm（※）
Maximum measurement depth	Less than 1mm for steel（※）
Depth resolution	Greater than 1μm（※）

※Depends on conditions of measurement                        

 

 

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